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Test Systems

group of interoperable devices whose integration perform a common test purpose.

See Also: Systems, Equipment, System Integrators, System Test, System Integration


Showing results: 4471 - 4485 of 5363 items found.

  • Machine Solutions

    ficonTEC Service GmbH

    Our machines employ industry-proven production technologies – micro-positioning, active/passive precision alignment, attachment via welding, soldering and/or bonding, and automated optical inspection. ficonTEC also provides a suite of test capabilities for individual components and hybrid opto-electronic devices, both on and off-wafer. Moreover, with everything being orchestrated by our flexible PROCESS CONTROL MASTER software, the machine platforms and product lines described below become so much more than just the sum of their parts. The technologies and capabilities implemented in all machine platforms translate into a broad and established spectrum of production process expertise. We are continually refining capability, modularity and design so that these systems reliably and cost-effectively meet and exceed efficiency and yield requirements even for cutting-edge production processes. For the team here at ficonTEC, we face your challenges every day.

  • Mobile Testing Power Supply(Microamp)

    M8831 - Maynuo Electronic Co.,Ltd

    M8831 Power supply,  a new generation of programmable linear power supply, are designed with high speed dynamic programming output(Voltage 0-30V, 1ms rising time), high current accuracy (0.001mA resolution) and low internal resistance, which can satisfy all the test requirements. The combination of bench-top and system features in these power supplies not only make it possible to option into other equipments, but also make it possible for users to edit program by panel keyboard, which will bring much convenience to users. Meanwhile, the voltage level switch works without relay, which will cause the fast switch between high voltage and low voltage. Moreover, M8831 powr supply provides the best solutions for cellphone research, micro-electronics lab,research institue and special users requiring power supply with low current buthigh accuracy .

  • ICE 3000 Series

    ICE3009 - Pole/Zero

    The ICE3009 subsystem is an agile filter for the VHF-L, VHF-H and UHF frequency bands. It allows operation of a number of transceivers in a cosite environment. The VHF/UHF Filter provides multiple poles of RF selectivity to reduce broadband noise in transmit mode of operation and to reduce interfering signals at the transceiver’s RF input in receive mode at Have Quick II/IIa and SATURN tuning speeds. This design incorporates a flexible control scheme that can be configured at the factory for various radio interfaces (ARC-210, ARC-231, ARINC 429, etc.). The design is highly integrated and includes all filters, amplifiers, power supply, transmit and receive switching (including a bypass mode), and Built-in-Test (BIT). A mounting tray is available as an option for easy incorporation on your platform. This system is qualified for military applications. Cost-effective modifications are available on the ICE3009. Please contact your sales representative at 513.870.9060 or Support@PoleZero.com for details.

  • Programmable DC Power Supply

    62000L Series - Chroma ATE Inc.

    The Chroma 62000L Series Programmable DC power supplies have low noise linear performance and fast transient response. The units have many unique functions that are targeted for overall automated test system integration, automotive power electronics MCU/ECU, power semiconductors, wireless communications, etc. The 62000L Series is a high quality yet cost effective programmable DC Source, designed to meet the stringent requirements of the next generation of power electronics. The GPIB and USB control interfaces come standard with the 62000L Series, no additional purchase required. The 62000L Series can be easily remote controlled via either of these two interfaces. The 62000L weighs less than 2.5 kg, and its case measures 214.6W * 88.6H * 280D mm. Its light weight and compact size makes it easy to handle and stack safely.。

  • Waveguide Bends

    Fairview Microwave Inc.

    Fairview Microwave’s lines of precision waveguide bends are widely used in applications such as high efficiency RF, microwave and mm-wave transmissions, satellite and military communications, radar, telecom, instrumentation and test benches. In waveguide systems that require a signal to turn or bend 90 degrees, Fairview’s waveguide bends are used to facilitate that bend or turn without degrading the transmission signal. These WG bends operate from 5.85 GHz to 90 GHz across 12 frequency bands and are available in sizes from WR-12 to WR-137. This family of waveguide bends also boast low loss and VSWR as low as 1.08:1 and are available in both E-plane and H-plane configurations. They are constructed using gold plated, oxygen free hard copper (OFHC) or painted copper alloy depending on the model and are also offered with either a UG-style flange per the military standard or a CPR-style flange. Many models are RoHS compliant.

  • 16/32 -CH 16-Bit 250/500 KS/s Multi-Function DAQ Cards with Encoder Input

    PCI-9222/9223 - ADLINK Technology Inc.

    The ADLINK PCI-9222/PCI-9223 is a 16-bit, 16/32-CH, 250/500 KS/s high performance DAQ card with 8 different input ranges. It also features 2-CH 16-bit analog outputs capable of a 1 MS/s update rate, 2-CH encoder inputs, and programmable function I/O. The software-programmable function I/O supports a variety of applications, including TTL digital I/O, high-speed DIO, general-purpose timer/counter, pulse generation, and PWM output. Analog input, analog output, and function I/O at full speed simultaneously, and multiple cards can be synchronized through the SSI (System Synchronization Interface) bus if users need more channels than a single board can provide. Ideal for mixed-signal tests, laboratory research, and factory automation, PCI-9222/PCI-9223 is the best single-board solution on the market providing the best integration capability of multiple tasks with high performance and an affordable price.

  • FPGA PXI High-Performance Digital I/O Card

    GX3700 - Marvin Test Solutions, Inc.

    The GX3700 is a user configurable, FPGA-based, 3U PXI card which offers 160 digital I/O signals which can be configured for single-ended or differential interfaces. The card employs the Altera Stratix III FPGA, which can support SerDes data rates up to 1.2 Gb/s, digital I/O clock rates of 700 MHz, and features 47,500 logic elements and 2.1 kb of memory. The GX3700 is supplied with an integral expansion board providing access to the FPGA’s 160 I/Os. Alternatively, users can design their own custom expansion cards for specific applications - eliminating the need for additional external boards which are cumbersome and physically difficult to integrate into a test system. The design of the FPGA is done by using Altera’s free Quartus II Web Edition tool set. Once the user has compiled the FPGA design, the configuration file can be loaded into the FPGA directly or via an on-board EEPROM.

  • STANAG3910/EFEX Modules

    AIM GmbH

    AIM’s STANAG3910/EFEX test, simulation, monitoring and analysis modules use our field proven Common Core hardware design giving you the best performance, best feature set and highest functional integration on the market. The use of SoC (System on Chip) based core designs with multiple processors for real time bus protocol and application support, massive memory and IRIG-B time code encoder/decoder functions are standard. The latest versions also support avionics discrete I/O. Configurations with dual redundant concurrent HS/LS Bus Controller (BC), Multiple Remote Terminals, and Chronological/Mailbox Bus Monitor operation with full HS/LS protocol error injection/detection, multi-level triggering, advanced capture/filtering and real time bus recording, time stamping and physical bus replay ensure your bus integrity. Support for EFAbus Direct Digital Links (DDL), Fibre Optic DDL (FODDL) and EFAbus Express extensions (Mixed Mode and Dual Mode operation) are available. To support the French ‘Rafale’ aircraft, modules are available with an Electrical Front End. Single Function variants support cost effective solutions. Each module is delivered with a Board Support Package (BSP) containing the onboard driver software, a full Application Programming Interface (API) and detailed getting started and programming guides. Powerful PBA.pro databus test and analysis software is optionally available for all our STANAG3910 modules.

  • Outdoor Exposure Tester

    OET - PSE Instruments GmbH

    A comprehensive analysis of PV modules includes many different parameters. Determining the normal module operating temperature (NMOT), incidence angle effects and comparing soiling effects on different modules up to the initial degradation of PV modules are all parameters that can be analyzed with our outdoor exposure tester. The tester comes with up to twelve electronic loads installed in a 19" rack. The loads have two main functions: maximum power point tracking (MPPT) and IV curve tracing. For the advanced analysis, it is possible to change between these two modes within one test. In the normal operation mode, the electronic load keeps the module under MPP and each predefined interval an IV curve is traced. The entire tester comes with all necessary sensors such as temperature sensor, which can be attached to the module to determine the NMOT temperature like defined in IEC 61215 (MQT 05) and IEC 61853-2. The irradiation sensor is also included. In combination with our tracking system P2, it is also possible to determine incident angle effects of the PV module. It is also possible to connect other irradiation sensors for diffuse and direct irradiation, which helps to understand the behavior of the module in different irradiation conditions. An optional albedo meter is a powerful tool for the analysis of bifacial modules. The entire graphical user interface is web based and offers the possibility to access the system from the all computers in the network.

  • FPGA PXIe High-Performance Digital I/O Card

    GX3700e - Marvin Test Solutions, Inc.

    The GX3700e is a user configurable, FPGA–based, 3U PXI Express card offering 160 digital I/O signals which can be configured for single-ended or differential interfaces. The card employs the Altera Stratix III FPGA, which can support SerDes data rates up to 1.2 Gb/s, digital I/O clock rates of 700 MHz, and features over 45,000 logic elements and 1.836 Kb of memory. The GX3700e is supplied with an integral expansion board providing access to the FPGA’s 160 I/Os. Alternatively, users can design their own custom expansion cards for specific applications - eliminating the need for additional external boards which are cumbersome and physically difficult to integrate into a test system. The design of the FPGA is done by using Altera’s free Quartus II Web Edition tool set. Once the user has compiled the FPGA design, the configuration file can be loaded directly into the FPGA or via an on-board EEPROM.

  • 5KVA to 100KVA Industrial UPS (3Ø – 1Ø)

    NSP Series 5KVA to 100KVA - Aplab Limited

    - Designed for powering critical Industrial and IT systems- DSP controlled IGBT based PWM technology- Design topology enables N+1 parallel redundancy- Industrial grade high speed CAN bus communication- User Friendly Matrix LCD and LED mimic front control and digital monitoring- Fully rated make before break maintenance bypass operation- Optional break-less load transfer via static switch- Low harmonic distortion- High crest factor tolerance and dynamic stability- Lower TCO- Continuous full rated power at ambient as high as 45°C- N+1 Parallel operation of UPS without any common hardware- Advanced Communication Capability (RS485/Modbus/SNMP)- High branch fuse clearing capacity- On-line battery bank test without load disconnection- Compact, elegant, and light weight enclosure- Easy installation with wheels for maneuverability and front bottom terminals

  • 20KVA to 200KVA Industrial UPS (3Ø – 3Ø)

    NSP Series 20KVA to 200KVA - Aplab Limited

    - Designed for powering critical Industrial and IT systems- DSP controlled IGBT based PWM technology- Design topology enables N+1 parallel redundancy- Industrial grade high speed CAN bus communication- User Friendly Matrix LCD and LED mimic front control and digital monitoring- Fully rated make before break maintenance bypass operation- Optional break-less load transfer via static switch- Low harmonic distortion- High crest factor tolerance and dynamic stability- Lower TCO- Continuous full rated power at ambient as high as 45°C- N+1 Parallel operation of UPS without any common hardware- Advanced Communication Capability (RS485/Modbus/SNMP)- High branch fuse clearing capacity- On-line battery bank test without load disconnection- Compact, elegant, and light weight enclosure- Easy installation with wheels for maneuverability and front bottom terminals

  • NI-9244, 400 Vrms L-N, 800 Vrms L-L, 50 kS/s/ch, 24-Bit, 3-Phase C Series Voltage Input Module

    783106-01 - NI

    400 Vrms L-N, 800 Vrms L-L, 50 kS/s/ch, 24-Bit, 3-Phase C Series Voltage Input Module - The NI‑9244 performs single-ended analog input. The wide measurement range makes it ideal for high-voltage measurement applications such as phasor measurements, power metering, power quality monitoring, industrial machinery, and motor test. You can also perform transient and harmonic analysis with high-speed simultaneous sampling. The NI‑9244 offers three channels, so you can connect single‑ or three‑phase measurement configurations such as WYE and delta. You can incorporate the NI‑9244 into systems to meet standards such as IEC 61010‑1, C37.90 and C37.60, IEC 60255‑22‑(1:7), IEC 60255‑1, C37.188 Class M and P, EMC section of IEC 60870, EMC sections of IEC 61850, IEC 61000‑4‑30 Class S, and IEC 61000‑4‑7.

  • Fibre Channel Modules

    AIM GmbH

    AIM’s Fibre Channel test, simulation and analysis modules use our field proven Common Core hardware design giving you the best performance, best feature set and highest functional integration on the market. The use of SoC (System on Chip) based core designs with one dual core RISC processor per port, massive and scalable DDR3 memory and IRIG-B time encoder/decoder functions are standard. The new ultra high performance intelligent 4-lane PCIe 2.0 interface modules offer 2 ports with full function test, simulation, monitoring and analyzer functions for Fibre Channel networks. The dual core processor provides onboard processing and data transfer capabilities for the most demanding Fibre Channel applications including upper layer protocol support done on board level. Large and high data throughput DDR3 RAM is accessible for the onboard processor as is a high performance FPGA implementing the customized Fibre Channel interfaces enabling the board to analyze incoming and modify outgoing data in real time. Each module provides 2 Fibre Channel compliant full duplex ports, implementing the full link level services. SFP cages make it suitable for different media types as optical or electrical network technologies. Ports operate either in Traffic Simulator or Analyzer/Monitor mode with support for port related Frame Statistics. Sophisticated packet capturing mechanism and monitoring features are complimented with powerful triggering and filtering capabilities.

  • Packaging Manufacturing

    KLA-Tencor Corp

    KLA’s extensive portfolio of packaging solutions accelerates the manufacturing process for outsourced semiconductor assembly and test (OSAT) providers, device manufacturers and foundries for a wide range of packaging applications. Innovations in advanced packaging, such as 2.5D/3D IC integration using through silicon vias (TSVs), wafer-level chip scale packaging (WLCSP), fan-out wafer-level packaging (FOWLP) and heterogeneous integration as well as a wide range of IC substrates create new and evolving process requirements. KLA offers systems for packaging inspection, metrology, die sorting and data analytics focused on meeting quality standards and increasing yield before and after singulation. SPTS provides a broad range of etch and deposition process solutions for advanced packaging applications. Orbotech offers a portfolio of technologies that includes automated optical inspection (AOI), automated optical shaping (AOS), direct imaging (DI), UV laser drilling, inkjet/additive printing and software solutions to ensure manufacture of the highest quality of IC substrates.

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